Solves cracking and delamination issues of conventional rigid epoxy adhesives under vibration and shock. Cured adhesive delivers elasticity and toughness to buffer external deformation.
Sealing encapsulation for automotive wire harnesses, connectors and waterproof terminals; end‑protection bonding for cable ends.
| Compatible Substrates | Metals, ceramics, plastics, rubbers, glass, glass‑fiber products, various plastics and wire‑harness terminals |
| Chemical Type | Two‑component Epoxy Structural Adhesive |
| Appearance | Pale‑yellow transparent |
| Working Time (25 °C) | 20‑30 min |
| Mixing Ratio | Volume ratio A:B = 1:1 |
| Curing Condition | Room‑temperature cure: 4‑8 h @25 °C; Heat‑accelerated cure: 30‑60 min @80 °C |
| Service Temperature Range | -50℃~100℃ |
Fast positioning: Ultra‑short working time, initial cure within 5 minutes. Eliminates long clamping‑waiting time and improves rework efficiency.
Urgent electronic rework, fast repair for ornaments, glass and stone materials, temporary positioning & prototyping on assembly lines, emergency repair under outdoor low‑temperature conditions.
| Compatible Substrates | Electronic components, ceramics, glass, rigid engineering plastics, stone materials |
| Chemical Type | Two‑component Epoxy Structural Adhesive |
| Appearance | Component A: Transparent viscous liquid; Component B: Transparent viscous liquid |
| Working Time (25 °C) | 3 min |
| Mixing Ratio | Weight ratio A:B = 1:1 |
| Curing Condition | Room temperature 5‑35 °C, reaches functional strength in 90 min; heat curing for optimized performance |
| Service Temperature Range | -60 °C ~ 120 °C |
Generous 30‑minute working time. Suitable for large‑area coating and multi‑point alignment operations, greatly reducing waste from batch glue mixing.
Mass assembly of electronic & electrical devices, insulation fixation for instrument wire harnesses, flat‑surface bonding for metal / glass / ceramics, and assembly‑line production of small precision industrial parts.
| Compatible Substrates | Electronic components, ceramics, glass, rigid engineering plastics, stone materials |
| Chemical Type | Two‑component Epoxy Structural Adhesive |
| Appearance | Component A: Transparent viscous liquid; Component B: Transparent viscous liquid |
| Working Time (25 °C) | 30 min |
| Mixing Ratio | Weight ratio A:B = 1:1 |
| Curing Condition | Room temperature 5‑35 °C, reaches functional strength in 90 min; heat curing for optimized performance |
| Service Temperature Range | -50℃~100℃ |
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