VS-SI828 for Chip Thermal Conduction
- High thermal conductivity and low thermal resistance, facilitating chip heat dissipation.
- Low viscosity to satisfy stencil printing process requirements.
- Conforms to uneven surfaces of components or housings for both heat dissipation and fixation.
| Product Model | VS-SI828 |
| Chemical Type | Thermal Grease |
| Curing Mode | Room-temperature Curing |
| Color | Grey |
| Application | Chip thermal conduction for AI smart glasses |
Contact Your Consultant
VS‑8806 for Flexible PCB Reinforcement
- Forms tough and flexible bonding after curing with high‑level vibration and impact resistance.
- Features high viscosity, fast curing speed and excellent weather resistance.
| Product Model | VS‑8806 |
| Chemical Type | Modified Acrylic |
| Curing Mode | UV‑light Curing |
| Color | Clear |
| Application | Flexible PCB reinforcement for AI smart glasses |
Contact Your Consultant
VS-9011 for Lens Sealing
- Delivers outstanding resistance to thermal cycling, stress variation and water.
- Withstands high and low temperatures; maintains elasticity and stability long-term from -40℃ to 200℃, featuring UV resistance and anti-aging properties.
- Offers excellent performance in waterproofing, insulation, moisture resistance, shock resistance, corona resistance, leakage resistance and chemical medium resistance.
| Product Model | VS-9011 |
| Chemical Type | One-component Silicone |
| Curing Mode | Room-temperature Curing |
| Color | Translucent |
| Application | Lens sealing for smart glasses |
Contact Your Consultant
VS-9101 for Pouch Cell Fixation
- Moisture-proof sealing, excellent insulation and good adhesion; it offers moisture resistance, shock resistance, corona resistance and leakage resistance.
- It adheres well to metals and most plastics. The cured adhesive has outstanding thermal cycling resistance and complies with EU RoHS and REACH environmental requirements.
| Product Model | VS-9101 |
| Chemical Type | Silicone |
| Curing Mode | Room-temperature Curing |
| Color | White semi-paste |
| Application | Pouch cell fixation for smart glasses |
Contact Your Consultant
VS-HT126 Adhesive for Smart Glasses Charging Case
- Short open time and short clamping time (5–10 min)
- Fast curing speed, rapid build-up of bonding strength
- Undergoes irreversible chemical reaction with moisture in air; cured material is tough and non-brittle
| Product Model | VS-HT126 |
| Chemical Type | PUR Hot Melt Adhesive |
| Curing Mode | Heat-activated Curing |
| Color | Clear or slightly yellow |
| Application | Smart glasses charging case |
Contact Your Consultant
VS‑HT125 Frame & Housing Bonding
- Wide substrate compatibility and high bonding strength
- Excellent initial tack performance
- Environment‑friendly material
- Superior chemical resistance
- Repairable
- Excellent drop‑resistance performance
| Product model | VS-HT125 |
| Chemical type | Polyurethane |
| Curing type | Moisture‑curing |
| Color | Transparent |
| Application Area | Bonding for smart glasses frame and housing; compatible substrates: metal, glass, engineering plastics, etc. |
Contact Your Consultant
VS‑3320 Barrel‑to‑PCB Bonding
- Fast low‑temperature curing, suitable for thermally‑sensitive electronic components
- Excellent adhesion performance with high bonding strength
- Stable product performance with wide application scope
- Low shrinkage after adhesive curing
- High strength, good impact resistance
- Safe & eco‑friendly, free of harmful solvents and volatile organic compounds (VOC‑free)
- High Tg value, outstanding heat resistance
| Product model | VS-3320 |
| Chemical type | epoxy resin |
| Curing type | Heat‑curing |
| Color | black |
| Application Area | Camera module IR lens & motor, voltage coupling components, memory cards, etc. |
Contact Your Consultant
VS-EP219 BGA/CSP chip underfill
Excellent capillary filling capacity
High Tg, excellent heat resistance
Rapid curing at moderate temperature
Compatible with most lead-free solder
After curing, it exhibits excellent mechanical properties
Stable electrical performance
Low CTE effectively mitigates stress impact caused by differences in thermal expansion
Repairable
| Product model | VS-EP219 |
| Chemical type | epoxy resin |
| Curing type | curing by heating |
| Color | black |
| Application Area | BGA / CSP Underfill |
Contact Your Consultant
