VS‑HT125 Frame & Housing Bonding
- Wide substrate compatibility and high bonding strength
- Excellent initial tack performance
- Environment‑friendly material
- Superior chemical resistance
- Repairable
- Excellent drop‑resistance performance
| Product model | VS-HT125 |
| Chemical type | Polyurethane |
| Curing type | Moisture‑curing |
| Color | Transparent |
| Application Area | Bonding for smart glasses frame and housing; compatible substrates: metal, glass, engineering plastics, etc. |
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VS‑3320 Barrel‑to‑PCB Bonding
- Fast low‑temperature curing, suitable for thermally‑sensitive electronic components
- Excellent adhesion performance with high bonding strength
- Stable product performance with wide application scope
- Low shrinkage after adhesive curing
- High strength, good impact resistance
- Safe & eco‑friendly, free of harmful solvents and volatile organic compounds (VOC‑free)
- High Tg value, outstanding heat resistance
| Product model | VS-3320 |
| Chemical type | epoxy resin |
| Curing type | Heat‑curing |
| Color | black |
| Application Area | Camera module IR lens & motor, voltage coupling components, memory cards, etc. |
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VS-EP219 BGA/CSP chip underfill
Excellent capillary filling capacity
High Tg, excellent heat resistance
Rapid curing at moderate temperature
Compatible with most lead-free solder
After curing, it exhibits excellent mechanical properties
Stable electrical performance
Low CTE effectively mitigates stress impact caused by differences in thermal expansion
Repairable
| Product model | VS-EP219 |
| Chemical type | epoxy resin |
| Curing type | curing by heating |
| Color | black |
| Application Area | BGA / CSP Underfill |
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