VS‑9011 High‑Performance General‑Purpose Grade
Direct bonding to silicone substrates without primer, eliminating surface pre‑treatment procedures. Solves typical challenges of poor silicone adhesion and rework caused by delamination.
- Semi‑flowable consistency, self‑leveling to fully fill gaps, preventing sealing leakage and electric creepage.
- Resists thermal cycling and stress deformation, maintains long‑term elasticity without cracking or peeling.
- Ultra‑high insulation resistivity, multi‑protection performance including waterproofing, moisture resistance, shock resistance, corona resistance and chemical resistance.
Bonds silicone without pre‑treatment; also suitable for waterproof sealing and bonding of hard‑to‑bond materials, metals and plastics.
- Bonding & fixing for components under high‑low‑temperature conditions with flame‑retardant requirements; insulation and shock protection for electronic devices.
Product Features
Application Scenarios
| Compatible Substrates | Metal alloys, glass, ceramics, various engineering plastics, PCB circuit boards, instrument housings |
| Chemical Type | One‑component room‑temperature‑curing silicone |
| Color & Appearance | Translucent semi‑flowable paste |
| Tack‑Free Time | 5~10min |
| Curing Condition | Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days. |
| Temperature Resistance Range | -40℃~200℃ |
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VS‑SI703 High‑Temperature‑Resistant Grade
One‑component RTV moisture‑curing silicone rubber. Red paste thixotropic grade, non‑sagging, excellent filling performance for flange surfaces.
- Extreme temperature resistance:‑60℃~300℃, far superior to ordinary silicone rubber. Maintains elasticity under long‑term high‑temperature working conditions without powdering or cracking.
- Shock and impact resistance, retains rubber elasticity under thermal cycling conditions.
- Resistant to engine oil, coolant and weak chemicals. Insulating and moisture‑proof, with both sealing and mild bonding performance.
Bonding & fixing, insulating potting, waterproof and shock‑resistant coating for electronics, small home appliances and instruments.
- Flange joint sealing for high‑temperature equipment housings, heating components, metal, glass and plastic substrates.
Product Features
Application Scenarios
| Compatible Substrates | Metals, glass, ceramics, rigid engineering plastics and their alloys |
| Chemical Type | One‑component room‑temperature‑curing silicone |
| Color & Appearance | Red paste |
| Thermal Conductivity | 10‑30 min |
| Curing Condition | Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days. |
| Temperature Resistance Range | -60℃~300℃ |
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VS‑9094 One‑Component Sealing Silicone
Excellent thixotropy; no sagging on vertical surfaces. Delivers strong adhesion strength.
- Resists thermal cycling, stress deformation and UV aging.
- Outstanding shock‑absorbing performance. Maintains gel elasticity under repeated temperature cycles, resisting cracking and failure.
- Waterproof, moisture‑proof and leakage‑resistant. Tolerates weak chemical corrosion, providing both sealing and bonding functions.
Waterproof sealing and dust‑proof bonding for hard‑to‑bond materials, metals and engineering plastics.
- Bonding & fixing, insulation and shock protection for components operating under high‑low‑temperature conditions with flame‑retardant requirements.
- Housing joint sealing for power battery packs; structural bonding for small home appliances and industrial control equipment.
Product Features
Application Scenarios
| Compatible Substrates | Various hard‑to‑bond substrates, metals, rigid engineering plastics |
| Chemical Type | One‑component room‑temperature‑curing silicone |
| Color & Appearance | Black paste |
| Tack‑Free Time | 5~10min |
| Curing Condition | Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days. |
| Temperature Resistance Range | -40~150℃ |
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VS‑SI844 Ultra‑High Thermal Conductivity Grade
Ultra‑high thermal conductivity & low thermal resistance: Thermal conductivity of 7.0 W/m·K, rapidly fills gaps for efficient heat dissipation.
- Suitable for automated dispensing: High extrudability and low‑viscosity paste, compatible with high‑speed automatic dispensing processes.
- Low‑stress & non‑damaging: Soft gel texture with no curing shrinkage, delivering zero‑stress protection for precision components.
- Low‑volatility & anti‑oil‑bleeding: Solvent‑free formula with extremely low volatile content and oil‑bleed tendency. Resists oil bleeding and aging under long‑term high‑temperature operation. UL94 V‑0 flame‑retardant and insulating.
Interface thermal filling between high‑power chips, power components and heat sinks.
- Heat dissipation for uneven contact surfaces in communication equipment, consumer electronics, automotive electronics, module power supplies, optical communication modules, etc.
Product Features
Application Scenarios
| Compatible Substrates | PCB circuit boards, aluminum‑copper metals, plastics, ceramics, various high‑power chips, heat‑sink housings |
| Chemical Type | Silicone thermal gel |
| Color & Appearance | Blue paste |
| Thermal Conductivity | 7.0 W/m·K |
| Curing Condition | Heat transfer upon physical contact; no curing waiting time required |
| Temperature Resistance Range | -50℃~200℃ |
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VS‑SI847 Fast Thermal‑Conductive Grade for Irregular Gaps
Thermal conductivity of 4.5 W/m·K with excellent wettability. Easily fills various irregular gaps and reduces interfacial thermal resistance.
- Ultra‑high extrudability, compatible with automated dispensing, ensuring smooth and efficient mass production.
- UL94 V‑0 flame‑retardant & insulating, stable and durable over wide temperature range.
Interface thermal filling between high‑power chips, power components and heat sinks.
- Heat dissipation for uneven contact surfaces in communication equipment, consumer electronics, automotive electronics, module power supplies, optical communication modules, etc.
Product Features
Application Scenarios
| Compatible Substrates | PCB circuit boards, aluminum & copper metals, plastics, ceramics, various high‑power chips, heat‑sink housings |
| Chemical Type | Silicone thermal gel |
| Color & Appearance | Pink paste |
| Thermal Conductivity | 4.5W/m·K |
| Curing Condition | Curing ConditionHeat transfer upon physical contact; no curing waiting time required |
| Temperature Resistance Range | -40℃~200℃ |
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VS‑9208 CPU / LED General‑Purpose Thermal Grease
Efficiently fills micro air‑gaps, greatly reduces interfacial thermal resistance and solves poor heat dissipation of chips.
- Non‑corrosive formulation, will not etch metal contact surfaces, avoiding component corrosion caused by long‑term service.
- Stable paste consistency, non‑curing. No drying, cracking or hardening. Prevents heat dissipation degradation after repeated disassembly and reassembly.
Interface thermal filling for power devices, LED lamps, computer CPUs, automotive headlights, communication equipment and household appliances.
Product Features
Application Scenarios
| Compatible Substrates | Aluminum‑copper metal heat sinks, PCB circuit boards, ceramic substrates, plastic housings, semiconductor power chips |
| Chemical Type | Silicone thermal grease (non‑curing paste type) |
| Color & Appearance | Grey paste |
| Thermal Conductivity | 4.5W/m·K |
| Curing Condition | Heat transfer upon physical contact; no curing waiting time required |
| Temperature Resistance Range | -40℃~200℃ |
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VS‑SI404 Weather‑Resistant Toughened Grade
Toughened low‑stress protection: High‑elongation tough gel absorbs mechanical vibration and thermal shock. Accommodates thermal expansion and contraction of housings to reduce stress damage to components.
- High waterproof & weather resistance: Excellent adhesion performance, UV‑resistant, chemical‑resistant and anti‑yellowing. Maintains silicone elasticity over wide temperature range of ‑60℃~250℃, suitable for long‑term outdoor service.
- Reliable electrical insulation & thermal conductivity: Good insulation and thermal conductivity, compliant with RoHS environmental requirements.
Solar junction boxes, module power supplies, circuit boards, automotive ECU, sensors.
- Potting protection for electronic components exposed to outdoor water, vibration and thermal shock.
Product Features
Application Scenarios
| Compatible Substrates | PV housings, plastics, metals, circuit‑board assemblies |
| Chemical Type | Two‑component silicone potting compound |
| Mixing Ratio | A:B = 10:1 (by weight) |
| Color | Part A: Black / White / Grey; Part B: Colorless / Slight yellow |
| Working Time | 30‑40 min |
| Curing Conditions | Full cure in 24 h at 25℃ |
| Temperature Resistance Range | -60℃-250℃ |
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VS‑SI433 Insulation Grade
Excellent insulation & low‑stress property: Cures into soft elastomer, stable under high‑voltage conditions. Absorbs vibration and thermal cycling to protect components from damage.
- Weather & wide‑temperature resistance: UV aging resistant, stable long‑term performance from ‑45℃ to 180℃.
- Flame‑retardant safety: Compliant with UL94‑V0 flame‑retardant certification.
Resists moisture and environmental corrosion, mitigates mechanical shock and thermal vibration.
- Potting for loudspeakers, automotive electronic assemblies, transformers, high‑voltage resistors, sensors, power controllers and other components.
Product Features
Application Scenarios
| Compatible Substrates | PCB, metals, electronic assemblies, transformers, sensors |
| Chemical Type | Two‑component silicone potting compound |
| Mixing Ratio | A:B =10:1 (by weight) |
| Color | Part A: Black; Part B: Transparent |
| Working Time | 30‑40 min |
| Curing Conditions | Full cure in 24 h at 25℃ |
| Temperature Resistance Range | -45℃~180℃ |
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