粘接密封型-Dongguan Boxiang Electronic Materials Co., Ltd

Product Features

Direct bonding to silicone substrates without primer, eliminating surface pre‑treatment procedures. Solves typical challenges of poor silicone adhesion and rework caused by delamination.
Semi‑flowable consistency, self‑leveling to fully fill gaps, preventing sealing leakage and electric creepage.
Resists thermal cycling and stress deformation, maintains long‑term elasticity without cracking or peeling.
Ultra‑high insulation resistivity, multi‑protection performance including waterproofing, moisture resistance, shock resistance, corona resistance and chemical resistance.

Bonds silicone without pre‑treatment; also suitable for waterproof sealing and bonding of hard‑to‑bond materials, metals and plastics.
Bonding & fixing for components under high‑low‑temperature conditions with flame‑retardant requirements; insulation and shock protection for electronic devices.

Compatible Substrates	Metal alloys, glass, ceramics, various engineering plastics, PCB circuit boards, instrument housings
Chemical Type	One‑component room‑temperature‑curing silicone
Color & Appearance	Translucent semi‑flowable paste
Tack‑Free Time	5~10min
Curing Condition	Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days.
Temperature Resistance Range	-40℃~200℃

Contact Your Consultant

One‑component RTV moisture‑curing silicone rubber. Red paste thixotropic grade, non‑sagging, excellent filling performance for flange surfaces.
Extreme temperature resistance:‑60℃~300℃, far superior to ordinary silicone rubber. Maintains elasticity under long‑term high‑temperature working conditions without powdering or cracking.
Shock and impact resistance, retains rubber elasticity under thermal cycling conditions.
Resistant to engine oil, coolant and weak chemicals. Insulating and moisture‑proof, with both sealing and mild bonding performance.

Bonding & fixing, insulating potting, waterproof and shock‑resistant coating for electronics, small home appliances and instruments.
Flange joint sealing for high‑temperature equipment housings, heating components, metal, glass and plastic substrates.

Compatible Substrates	Metals, glass, ceramics, rigid engineering plastics and their alloys
Chemical Type	One‑component room‑temperature‑curing silicone
Color & Appearance	Red paste
Thermal Conductivity	10‑30 min
Curing Condition	Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days.
Temperature Resistance Range	-60℃~300℃

Contact Your Consultant

Excellent thixotropy; no sagging on vertical surfaces. Delivers strong adhesion strength.
Resists thermal cycling, stress deformation and UV aging.
Outstanding shock‑absorbing performance. Maintains gel elasticity under repeated temperature cycles, resisting cracking and failure.
Waterproof, moisture‑proof and leakage‑resistant. Tolerates weak chemical corrosion, providing both sealing and bonding functions.

Waterproof sealing and dust‑proof bonding for hard‑to‑bond materials, metals and engineering plastics.
Bonding & fixing, insulation and shock protection for components operating under high‑low‑temperature conditions with flame‑retardant requirements.
Housing joint sealing for power battery packs; structural bonding for small home appliances and industrial control equipment.

Compatible Substrates	Various hard‑to‑bond substrates, metals, rigid engineering plastics
Chemical Type	One‑component room‑temperature‑curing silicone
Color & Appearance	Black paste
Tack‑Free Time	5~10min
Curing Condition	Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days.
Temperature Resistance Range	-40~150℃

Contact Your Consultant