VS‑3545 Repairable Grade
Stable melt viscosity, smooth jet‑dispensing performance. Prevents glue overflow and nozzle clogging for displays, improving visual pass rate.
- Excellent wet‑out on multi‑substrates. Works well with glass, alloys and glass‑filled plastics, solving poor adhesion for display mid‑frame bonding.
- High toughness & impact resistance. Resists delamination and edge‑lifting under high‑low temperature cycling, suitable for daily drop scenarios of tablets.
- Supports non‑destructive rework & disassembly. No damage to displays and housings during rework, lowering scrap costs.
- Good resistance to humidity‑heat & aging. Stable bonding performance for long‑term use in automotive tablets.
Tablet display mid‑frame bonding, automotive display & instrument housing assembly. Compatible with PC, glass‑filled PA, aluminum alloy, glass, carbon‑fiber and other substrates.
Product Features
Typical Applications
| Compatible Substrates | PC, Glass‑filled PA, Aluminum alloy, Magnesium‑aluminum alloy, ABS, Glass |
| Chemical Type | PUR Moisture‑reactive Hot‑melt Adhesive |
| Appearance | White solid at room temperature |
| Open Time | 2~5 min |
| 100~130℃ | |
| Service Temperature Range | -50℃ ~ 110℃ |
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VS‑HT106 Fast‑Positioning General‑Grade
High initial tack strength. Enables fast positioning & bonding after dispensing; no long‑time compression required, improving production‑line efficiency.
- Moderate open time. Compatible with manual dispensing guns and automatic dispensing equipment, ideal for 3C & home‑appliance assembly lines.
- Bonds multiple substrates: plastics, acrylics, metals, FRP, solves the challenge of dissimilar‑material bonding.
- Good electrical insulation performance. Suitable for battery & touch‑screen bonding to provide insulation protection.
- Broad service‑temperature range. Maintains reliable bonding under high‑low temperature conditions, resistant to delamination and cracking.
3C digital housing, smart‑home enclosures, battery bonding, touch‑screen assembly
Product Features
Typical Applications
| Compatible Substrates | ABS, PC, Acrylic, Aluminum, FRP, PVC, Stainless Steel |
| Chemical Type | Liquid Polyurethane PUR |
Color & Appearance | Off‑white solid |
| Tack‑Free Time | 5‑7 min |
| Melting Temperature | 110~120 °C |
| Temperature Resistance Range | -30 °C ~ 110 °C |
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VS‑HT504 Non‑Heated Liquid Grade
Adopts non‑heating liquid PUR formula, no hot‑melt equipment required. Suitable for automated production lines and manual dispensing operations.
Direct bonding to silicone substrates, solves common whitening and fogging issues of conventional cyanoacrylate adhesives.
High initial bonding strength with moderate open time, allowing sufficient alignment and fitting after dispensing.
High elongation at break, flexible adhesive layer with good tear resistance, resistant to cracking and debonding under thermal cycling.
- Provides insulating sealing performance, suitable for structural bonding and protective assembly of electronic products.
Assembly for 3C digital housings, smart home enclosures, battery bonding, touch screens, keyboards and navigation devices.
Product Features
Application Scenarios
| Compatible Substrates | Silicone, ABS, PC, acrylic, aluminum, FRP, PVC, stainless steel |
| Chemical Type | Liquid Polyurethane PUR |
Color & Appearance | Translucent / Black / White (color optional) |
| Tack‑Free Time | 3~8 min |
| Curing Mechanism | Moisture curing |
| Temperature Resistance Range | -40℃ ~ 85℃ |
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