VS‑SI844 Ultra‑High Thermal Conductivity Grade
Ultra‑high thermal conductivity & low thermal resistance: Thermal conductivity of 7.0 W/m·K, rapidly fills gaps for efficient heat dissipation.
- Suitable for automated dispensing: High extrudability and low‑viscosity paste, compatible with high‑speed automatic dispensing processes.
- Low‑stress & non‑damaging: Soft gel texture with no curing shrinkage, delivering zero‑stress protection for precision components.
- Low‑volatility & anti‑oil‑bleeding: Solvent‑free formula with extremely low volatile content and oil‑bleed tendency. Resists oil bleeding and aging under long‑term high‑temperature operation. UL94 V‑0 flame‑retardant and insulating.
Interface thermal filling between high‑power chips, power components and heat sinks.
- Heat dissipation for uneven contact surfaces in communication equipment, consumer electronics, automotive electronics, module power supplies, optical communication modules, etc.
Product Features
Application Scenarios
| Compatible Substrates | PCB circuit boards, aluminum‑copper metals, plastics, ceramics, various high‑power chips, heat‑sink housings |
| Chemical Type | Silicone thermal gel |
| Color & Appearance | Blue paste |
| Thermal Conductivity | 7.0 W/m·K |
| Curing Condition | Heat transfer upon physical contact; no curing waiting time required |
| Temperature Resistance Range | -50℃~200℃ |
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VS‑SI847 Fast Thermal‑Conductive Grade for Irregular Gaps
Thermal conductivity of 4.5 W/m·K with excellent wettability. Easily fills various irregular gaps and reduces interfacial thermal resistance.
- Ultra‑high extrudability, compatible with automated dispensing, ensuring smooth and efficient mass production.
- UL94 V‑0 flame‑retardant & insulating, stable and durable over wide temperature range.
Interface thermal filling between high‑power chips, power components and heat sinks.
- Heat dissipation for uneven contact surfaces in communication equipment, consumer electronics, automotive electronics, module power supplies, optical communication modules, etc.
Product Features
Application Scenarios
| Compatible Substrates | PCB circuit boards, aluminum & copper metals, plastics, ceramics, various high‑power chips, heat‑sink housings |
| Chemical Type | Silicone thermal gel |
| Color & Appearance | Pink paste |
| Thermal Conductivity | 4.5W/m·K |
| Curing Condition | Curing ConditionHeat transfer upon physical contact; no curing waiting time required |
| Temperature Resistance Range | -40℃~200℃ |
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VS‑9208 CPU / LED General‑Purpose Thermal Grease
Efficiently fills micro air‑gaps, greatly reduces interfacial thermal resistance and solves poor heat dissipation of chips.
- Non‑corrosive formulation, will not etch metal contact surfaces, avoiding component corrosion caused by long‑term service.
- Stable paste consistency, non‑curing. No drying, cracking or hardening. Prevents heat dissipation degradation after repeated disassembly and reassembly.
Interface thermal filling for power devices, LED lamps, computer CPUs, automotive headlights, communication equipment and household appliances.
Product Features
Application Scenarios
| Compatible Substrates | Aluminum‑copper metal heat sinks, PCB circuit boards, ceramic substrates, plastic housings, semiconductor power chips |
| Chemical Type | Silicone thermal grease (non‑curing paste type) |
| Color & Appearance | Grey paste |
| Thermal Conductivity | 4.5W/m·K |
| Curing Condition | Heat transfer upon physical contact; no curing waiting time required |
| Temperature Resistance Range | -40℃~200℃ |
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