VS‑SI404 Weather‑Resistant Toughened Grade
Toughened low‑stress protection: High‑elongation tough gel absorbs mechanical vibration and thermal shock. Accommodates thermal expansion and contraction of housings to reduce stress damage to components.
- High waterproof & weather resistance: Excellent adhesion performance, UV‑resistant, chemical‑resistant and anti‑yellowing. Maintains silicone elasticity over wide temperature range of ‑60℃~250℃, suitable for long‑term outdoor service.
- Reliable electrical insulation & thermal conductivity: Good insulation and thermal conductivity, compliant with RoHS environmental requirements.
Solar junction boxes, module power supplies, circuit boards, automotive ECU, sensors.
- Potting protection for electronic components exposed to outdoor water, vibration and thermal shock.
Product Features
Application Scenarios
| Compatible Substrates | PV housings, plastics, metals, circuit‑board assemblies |
| Chemical Type | Two‑component silicone potting compound |
| Mixing Ratio | A:B = 10:1 (by weight) |
| Color | Part A: Black / White / Grey; Part B: Colorless / Slight yellow |
| Working Time | 30‑40 min |
| Curing Conditions | Full cure in 24 h at 25℃ |
| Temperature Resistance Range | -60℃-250℃ |
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VS‑SI433 Insulation Grade
Excellent insulation & low‑stress property: Cures into soft elastomer, stable under high‑voltage conditions. Absorbs vibration and thermal cycling to protect components from damage.
- Weather & wide‑temperature resistance: UV aging resistant, stable long‑term performance from ‑45℃ to 180℃.
- Flame‑retardant safety: Compliant with UL94‑V0 flame‑retardant certification.
Resists moisture and environmental corrosion, mitigates mechanical shock and thermal vibration.
- Potting for loudspeakers, automotive electronic assemblies, transformers, high‑voltage resistors, sensors, power controllers and other components.
Product Features
Application Scenarios
| Compatible Substrates | PCB, metals, electronic assemblies, transformers, sensors |
| Chemical Type | Two‑component silicone potting compound |
| Mixing Ratio | A:B =10:1 (by weight) |
| Color | Part A: Black; Part B: Transparent |
| Working Time | 30‑40 min |
| Curing Conditions | Full cure in 24 h at 25℃ |
| Temperature Resistance Range | -45℃~180℃ |
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VS‑3010 General‑Purpose Two‑Component Silicone Potting Compound
Thermal performance: Thermal conductivity of 0.6 W/m·K, ideal for potting and heat dissipation of power electronic components.
- Low‑stress protection: Forms soft elastomer after curing. Protects components against stress damage under harsh conditions of mechanical vibration and thermal cycling.
- Flame‑retardant property: Certified to UL94‑V0 for high safety performance.
General potting for electronics and electrical industry: connectors, sensors, transformers, relays, etc.
Product Features
Application Scenarios
| Compatible Substrates | PCB circuit board, metals (aluminum, copper), plastics, ceramics, glass fiber, power supply housings, etc. |
| Chemical Type | Two‑component silicone potting compound |
| Mixing Ratio | 1:1 (by weight) |
| Color | Part A: Grey; Part B: White |
| Working Time | 30~60 min |
| Curing Conditions | 2‑4 h at room temperature / 20‑30 min at 70℃ |
| Temperature Resistance Range | -60℃-200℃ |
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