Medium‑viscosity, High‑adhesion, Rigid UV Adhesive

• Outstanding weather resistance and electrical properties.

• Meets stringent reliability test requirements for automotive‑grade applications.
• Excellent adhesion performance on metal substrates.
• High rigidity after curing, good shock and impact resistance.

UV / Visible‑light Dual‑curing, High‑flexibility Waterproof UV Adhesive

• Cures under both UV and visible light. Fast fixture upon illumination with reliable deep‑section curing.

• Cured film features high flexibility & elongation. Resists water pressure and repeated deformation without cracking.
• Excellent insulation and water‑vapor resistance. No whitening or water leakage during long‑term service.

Medical‑Grade Low‑Viscosity High‑Light‑Transmission UV Adhesive

• High transparency after curing, will not block light source of LED beads. No yellowing or haze upon light transmission.

• Fast curing under UV cold‑light source. Complete depth‑of‑cure for 1 mm bond‑line, suitable for automated mass‑production assembly lines for masks.
• Flexible cured film absorbs vibration stress, preventing fracture & falling‑off of LED solder joints and extending service life.
• High dielectric strength and moisture resistance. Isolates solder joints from air oxidation, ensures stable circuit performance without short‑circuit over long‑term operation.

Medical‑Grade High‑Flexibility UV Adhesive

• Medium viscosity with stable hanging property. Fills tiny gaps completely, no dripping or overflow.

• UV / visible‑light dual‑wavelength curing. Full depth curing for 2 mm thick bond‑line, compatible with automated medical production lines.
• Ultra‑high elongation at break. Flexible adhesive layer absorbs insertion‑extraction stress of needles, preventing delamination and leakage.
• Low internal stress. No whitening or cracking when bonding transparent medical plastics, maintaining clean transparent appearance.

High‑viscosity Low‑shrinkage UV Adhesive

• High viscosity to avoid adhesive flow. Designed for potting & protection of sweeper fan PCBA solder joints and wire terminals.

• Low curing shrinkage, low‑stress protection for delicate circuits. No delamination or cracking during long‑term service.
• High cured hardness and fast surface‑dry speed. Resists continuous vibration impact from high‑speed fan operation.
• Excellent electrical insulation performance. Blocks dust and moisture, preventing oxidation and short‑circuit of fan PCB solder joints.

Low‑viscosity Dual‑wavelength Flexible UV Adhesive

• Low viscosity & excellent self‑levelling property. Forms complete thin coating on curved surfaces of cylindrical cells without bubbles or dead zones. Suitable for automatic spraying and dispensing processes.

• Cured film features high flexibility and deformation resistance. No peeling or cracking under charge‑discharge thermal cycling.
• Visible‑light curable. Cures through minor light obstruction. One‑shot curing for dark substrates and pole‑post gaps, no secondary re‑irradiation required.
• Resistant to electrolyte corrosion. Forms dense barrier layer to prevent shell erosion, improving battery service life and safety performance.

Fast‑cure, medium‑viscosity, flexible UV adhesive

• Protective encapsulation for NTC thermistors and BMS fuses in new‑energy & energy‑storage batteries

• Excellent filling & bonding performance on nickel tab bumps, FR4 and flexible materials

• Ultra‑low water absorption, blocks moisture intrusion for precision electronic components

• Compliant with strict automotive‑grade reliability standards

Fast‑cure, high‑viscosity, tough & flexible UV adhesive

• Medium‑high viscosity & low thixotropy, fully encapsulate pins with varied pitch and height

• Compatible with SMT & pin‑in connectors for bonding and sealing

• Single UV curing depth up to 5‑8 mm, ideal for thick‑layer connector encapsulation

• Full set of automotive‑grade reliability qualification passed

• 8‑year field experience in new‑energy industry, validated by millions of vehicle assemblies