VS‑3027 High‑Temperature‑Resistant Grade
Addresses leakage and insufficient voltage‑withstand issues of high‑voltage electronic components. Delivers high dielectric strength and reliable protection.
- Low shrinkage upon curing. No gaps or cracks caused by temperature fluctuation, ensuring superior sealing stability.
- Continuous heat resistance up to 160 °C, suitable for long‑term operation of transformers, high‑voltage coils and other high‑temperature‑working components.
- Low viscosity & high fluidity. Easy for vacuum degassing & potting, avoiding air bubbles that impair insulation performance.
Insulation sealing and potting for capacitors, transformers, high‑voltage coils, motors and other power‑electronic components. Designed for insulation protection and moisture‑proof encapsulation of high‑voltage electrical parts.
Product Features
Typical Applications
| Compatible Substrates | PCB circuit boards, metal iron cores, plastic housings, ceramics and other electronic components |
| Chemical Type | Two‑component Epoxy Potting Adhesive |
| Appearance | Component A: Black; Component B: Brown |
| Working Time (25 °C) | 60 min |
| Mixing Ratio | Weight ratio A:B = 5:1 |
| Curing Condition | Room‑temperature cure: 10 h @25 °C; Heat‑accelerated cure: 2 h @60 °C |
| Service Temperature Range | -40 °C ~ 160 °C |
Contact Your Consultant
VS‑6008 Flexible Sealing Grade for Wire‑Harness
Solves typical pain points of delamination and water‑penetration for bonding inert plastics and wire harnesses; delivers excellent waterproof sealing performance.
- Flexible adhesive layer with vibration resistance; avoids cracking and failure caused by rigid adhesives during long‑term service.
- High thixotropy, no sagging. No glue overflow during vertical‑surface dispensing; bright glossy appearance after full curing.
- Insulating, aging‑resistant and non‑corrosive. Prevents leakage‑induced corrosion for long‑term wire‑harness service.
- Dual‑curing mode, supports both mass‑production assembly‑line and small‑batch manufacturing requirements.
Bonding & sealing for various wire harnesses, connectors, waterproof cables, terminals and sports equipment.
- Bonding, fixing, repairing and potting of electronic components, metal hardware parts, ceramics, rubbers and glass‑fiber reinforced products.
Product Features
Typical Applications
| Compatible Substrates | PVC, TPU, PC, ABS, PS, TPE, Nylon and other plastics |
| Chemical Type | Two‑component Epoxy Potting Adhesive |
| Appearance | Component A: Transparent; Component B: Yellow‑transparent |
| Working Time (25 °C) | 30~40 min |
| Mixing Ratio | Volume ratio A:B = 1:1 |
| Curing Condition | Room‑temperature cure: 8‑12 h @25 °C; Heat‑accelerated cure: 30‑60 min @80 °C |
| Service Temperature Range | -40~125℃ |
Contact Your Consultant
