VS‑3010 General‑Purpose Two‑Component Silicone Potting Compound
Thermal performance: Thermal conductivity of 0.6 W/m·K, ideal for potting and heat dissipation of power electronic components.
- Low‑stress protection: Forms soft elastomer after curing. Protects components against stress damage under harsh conditions of mechanical vibration and thermal cycling.
- Flame‑retardant property: Certified to UL94‑V0 for high safety performance.
General potting for electronics and electrical industry: connectors, sensors, transformers, relays, etc.
Product Features
Application Scenarios
| Compatible Substrates | PCB circuit board, metals (aluminum, copper), plastics, ceramics, glass fiber, power supply housings, etc. |
| Chemical Type | Two‑component silicone potting compound |
| Mixing Ratio | 1:1 (by weight) |
| Color | Part A: Grey; Part B: White |
| Working Time | 30~60 min |
| Curing Conditions | 2‑4 h at room temperature / 20‑30 min at 70℃ |
| Temperature Resistance Range | -60℃-200℃ |
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VS‑9011 High‑Performance General‑Purpose Grade
Direct bonding to silicone substrates without primer. Eliminates surface pre‑treatment processes, solving difficult issues of poor silicone adhesion and rework caused by adhesive delamination.
- Semi‑flowable consistency, self‑leveling to fully fill gaps, achieving complete gap filling and preventing water leakage and electrical leakage.
- Resists thermal cycling and stress deformation. Maintains long‑term elasticity without cracking or delamination.
- Ultra‑high insulation resistivity, multi‑protection properties including waterproofing, moisture resistance, shock resistance, corona resistance and chemical resistance.
Bonds silicone without pre‑treatment; also suitable for waterproof sealing and bonding of hard‑to‑bond materials, metals and plastics.
- Bonding & fixing of components under high‑low temperature conditions with flame‑retardant requirements; insulation and shock‑resistance protection for electronic and electrical devices.
Product Features
Application Scenarios
| Compatible Substrates | Metal alloys, glass, ceramics, various engineering plastics, PCB circuit boards, instrument housings |
| Chemical Type | One‑component room‑temperature‑curing silicone |
| Color | Translucent semi‑flowable paste |
| Tack‑Free Time | 5‑10 min |
| Curing Conditions | Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days. |
| Temperature Resistance Range | -40℃~200℃ |
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VS‑SI703 High‑Temperature‑Resistant Grade
One‑component RTV moisture‑curing silicone rubber. Red paste thixotropic grade, non‑sagging, excellent filling performance for flange surfaces.
- Extreme temperature resistance:‑60℃~300℃, far superior to ordinary silicone rubber. Maintains elasticity under long‑term high‑temperature working conditions without powdering or cracking.
- Shock and impact resistance, retains rubber elasticity under thermal cycling conditions.
- Resistant to engine oil, coolant and weak chemicals. Insulating and moisture‑proof, with both sealing and mild bonding performance.
Bonding & fixing, insulating potting, waterproof and shock‑resistant coating for electronics, small home appliances and instruments.
- Flange joint sealing for high‑temperature equipment housings, heating components, metal, glass and plastic substrates.
Product Features
Application Scenarios
| Compatible Substrates | Metals, glass, ceramics, rigid engineering plastics and their alloys |
| Chemical Type | One‑component room‑temperature‑curing silicone |
| Color | Red paste |
| Tack‑Free Time | 10‑30 min |
| Curing Conditions | Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days. |
| Temperature Resistance Range | -60℃~300℃ |
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VS‑9094 One‑Component Sealant Silicone
Excellent thixotropy: No sagging or dripping when applied on vertical surfaces, delivering strong adhesion.
- Resists thermal shock, stress deformation and UV aging.
- Outstanding shock‑absorbing performance. Maintains rubber elasticity under repeated temperature cycling, resisting cracking and failure.
- Waterproof & moisture‑proof, insulation against leakage. Resists mild chemical corrosion, providing both sealing and bonding functions.
Waterproof sealing and dust‑proof bonding for hard‑to‑bond substrates, metals and engineering plastics.
- Bonding & fixing, insulation and shock resistance for components working under high‑low temperature with flame‑retardant requirements.
- Housing joint sealing for power battery packs; structural bonding for small home appliances and industrial control equipment.
Product Features
Application Scenarios
| Compatible Substrates | Hard‑to‑bond materials, metals, rigid engineering plastics |
| Chemical Type | One‑component room‑temperature‑curing silicone |
| Color | Black paste |
| Tack‑Free Time | 5‑10 min |
| Curing Conditions | Moisture‑curing at ambient temperature. Initial cure within 24 h for thickness ≤3 mm; optimal performance achieved in 7 days. |
| Temperature Resistance Range | -40℃~150℃ |
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VS‑3010 General‑Purpose Two‑Component Silicone Potting Compound
Thermal conductivity: Thermal conductivity of 0.6W/m·K, suitable for potting and heat dissipation of power components.
- Low‑stress protection: Forms a soft elastomer after curing. Protects components from stress damage under harsh conditions such as mechanical vibration and thermal cycling.
- Flame‑retardant performance: Complies with UL94‑V0 flame retardant certification for high safety.
General potting for electronics & electrical industry: connectors, sensors, transformers, relays, etc.
Product Features
Application Scenarios
| Compatible Substrates | PCB circuit board, metals (aluminum, copper), plastics, ceramics, glass fiber, power supply housings, etc. |
| Chemical Type | Two‑component silicone potting compound |
| Mixing Ratio | 1:1 (by weight) |
| Color | Part A: Grey; Part B: White |
| Working Time | 30~60 min |
| Curing Conditions | 2‑4 h at room temperature / 20‑30 min at 70℃ |
| Temperature Resistance Range | -60℃-200℃ |
Contact Your Consultant
